
	*About Qseven*

Diamond Systems Joins Qseven Consortium

March 2^th, 2010

Leading embedded solution provider to team up Qseven™ computer-on-modules with FeaturePak™ I/O modules for rapid development of application-oriented OEM baseboards (details...).

Qseven Design Guide available

September 17^th, 2009

The Qseven™ Design Guide Rev 0.8 is now available for download (details...).

Carrier Board Schematics released

August 31^th, 2009

The schematics for the Qseven™ Reference Carrier Board are available for download (details...).

Foxconn Technology Group joins Qseven Consortium

April 21th, 2009

The world’s best end-to-end manufacturing services provider has joined the Qseven standard thereby ensuring the long-term availability of MXM connectors (details...).

Specification Rev. 1.11 Released

November 26th, 2008

The Qseven Specification Revision 1.11 is now available for download (details...).

The New Module Standard

Compact, Square & Cost Efficient

Module Concept for Ultra Mobile Applications

Low Cost
Low Power Consumption
Legacy Free
Fast Serial Interfaces

Defined Interfaces

4x PCI Express x1 Lanes
2x SATA
8x USB 2.0
1x 1000BaseT Ethernet
1x SDIO 8 Bit
LVDS 2x 24 Bit
SDVO / HDMI / DisplayPort (shared)
HDA (High Definition Audio)
I²C Bus
LPC (Low Pin Count Bus)
Fan Control
Power Management Signals
Battery Management
5V Power (TDP 12 Watt)
Unique API for I²C Bus, Watchdog Timer and EPI (Embedded Panel Interface)
Thermal Cooling Interface defined

Design Guide

In progress
Will be available here in Q1/2009

Typical Applications

Automation
DIN Rail Systems
Ultra Mobile
Mobile

Connector

The used MXM edge connector is a robust, single-connector solution that is capable of handling high speed PCI Express signals. This connector is available in 2 different heights (5.5mm and 7.8mm) for maximum flexibility.
SMT Type 0.50mm [.020”] Pitch, 230 Pos, Foxconn AS0B3 Series (MXM Socket)